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Electrostatic engineering of electronic and structural orderings in two-dimensional materials

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报告题目   Electrostatic engineering of electronic and structural orderings in two-dimensional materials
报告人   Dr. WANG Ying
报告人单位   Nanoscale Science and Engineering Center, University of California, Berkeley
报告时间   2018-06-15
报告地点   合肥微尺度物质科学国家研究中心九楼会议室(9004)
主办单位   合肥微尺度物质科学国家研究中心、国际功能材料量子设计中心(ICQD)
报告介绍
Abstract
  Two-dimensional (2D) transition metal dichalcogenide (TMDC) materials provide an attractive semiconductor option at the atomic level. These materials exhibit great promise to enable the development of novel devices in a variety of fields, including nanophotonics, valleytronics and information technology. Meanwhile, the atomic thickness of two-dimensional materials allows full access to the interior of materials through electrostatic doping. Thus, electrostatic doping becomes one main approach to exploit the fundamental physics and practical application in the 2D limit. In this talk, I will present our work in engineering of electronic and structural ordering using large population of quasi-particles, including:
·         Optimal thermoelectric effect in TMDs, simultaneously optimizing Seebeck coefficient and electrical conductivity [1].
·         Demonstration of structural reformation of monolayer molybdenum ditelluride (MoTe2) through electrostatic doping [2].
 
[1]      K. Hippalgaonkar*, Y. Wang*, Y. Ye*, D. Y. Qiu, H. Zhu, Y. Wang, J. Moore, S. G. Louie, and X. Zhang, Phys. Rev. B 95, 115407 (2017).
[2]      Y. Wang*, J. Xiao*, H. Zhu, Y. Li, Y. Alsaid, K. Y. Fong, Y. Zhou, S. Wang, W. Shi, Y. Wang, A. Zettl, E. J. Reed, and X. Zhang, Nature 550, 487 (2017).
 
Biography:
  Dr. Ying Wang received a Ph.D. degree in Applied Physics & Technology from UC Berkeley (2018) and a B.S. degree in Physics from Nanjing University (2012). And She won gold medal of Graduate Student Award from Materials Research Society (MRS) with high-impact journal papers including publications in Nature, Nature Communications and Physical Review Letters et al.

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