报告题目 | Polymer-Assisted Metal Deposition-An Interfacial Chemical Approach For Soft Electronics |
报告人 | 郑子剑 教授 |
报告人单位 | 香港理工大学 |
报告时间 | 2016-10-31 |
报告地点 | 合肥微尺度物质科学国家实验室一楼科技展厅 |
主办单位 | 合肥微尺度物质科学国家实验室、中国科学技术大学化学与材料科学学院 |
报告介绍 | Abstract:
Our laboratory recently develops Polymer-Assisted Metal Deposition (PAMD). PAMD allows ambient fabrication of flexible, foldable, stretchable, compressible, and wearable metal (especially Cu) conductors with very high conductivity. The key innovation of PAMD is the use of a thin and functional polymeric interfacial layer that assists electroless deposition (ELD) of metal thin films and patterns (Au, Ag, Cu, and Ni) on soft substrates such as plastics, elastomers, papers, and polyurethane sponges. Such a polymer interfacial layer offers remarkable adhesion between metal and substrate, which is critical for enhancing the mechanical durability of the metal layer upon large deformation. In general, PAMD includes three steps, being (1) surface grafting of functional interfacial polymer, (2) immobilization of the catalytic moieties, (3)metal deposition by ELD. Importantly, PAMD is compatible with versatile substrates and different printing technologies at ambient conditions. This seminar will discuss the materials chemistry of PAMD and demonstrate their applications in several important soft electronic devices including circuits, solar cells, and transistors.
Biosketch: |